contactresistance相关论文
选用TiO2作为触头材料的添加剂,采用粉末冶金法制备了6种不同第二相(SnO2)粒度的AgSnO2和AgSnO2/TiO2触头材料.研究了2种触头材料......
TiN–Ag composite coatings were prepared by pulsed bias arc ion plating. X-ray diffraction (XRD) and energy dispersive X......
A synergetic strategy based on laser surface texturing and lubricating grease for improving the trib
Herein, a series of Ag coatings with different micro-dimples were fabricated on copper surfaces by laser surface texturi......
The arc erosion under medium direct currents in the argon flow was tested on tungsten-copper (W-Cu) contacts which were ......
InAs nanowires(NWs)are competitive candidates for high performance n-type devices owing to their high electron mobility,......
Effect of Ag nanoparticles formed by forming gas annealing on contact resistance of screen-printed A
Screen-printed Ag thick-film metallization is the most widely used technique for the front-side emitter contacts of comm......
Heterojunction effect on contact resistance minimization in staggered pentacene thin-film transistor
Organic thin-film transistors(OTFTs)have the potential in future flexible electronics,including radio frequency identifi......
A study has been undertaken of the temperature rise prediction for a medium voltage (MV) switching cabinet using a three......
Experimental Investigation on the Role of Sphere Indenter in Measuring Contact Resistance of Flat Ri
The relationship between contact force and contact resistance during loading and unloading process were measured explici......
The time variation of contact resistance of silver contacts is measured.The contacts are contacted at constant contact l......
A PEMFC (Polymer Electrolyte Membrane Fuel Cell) stack is composed of GDL (Gas Diffusion Layer), MEA (membrane electrode......
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Thermal stability of nonvolatile organic memory transistor based on Poly (methyl methacrylate) as ch
We have studied the electrical properties of nonvolatile organic field-effect transistor (OFET) memory devices with Poly......
Monolayer molybdenum disulfide(MoS2)is a two-dimensional semiconductor with direct band gap of 1.8 eV.Due to its uni......
During the process of the integration and miniaturization design of electronics, the thermal analysis of the printed......
Ag-Mo electrical contact material used in solenoid actuator showed high resistance during storage and with only a fe......
测试了颗粒吸附剂(沸石/聚苯胺复合物)、成型吸附剂与铜表面之间的接触热阻以及导热胶对吸附剂与铜表面之间的接触热影响。结果表明,成......
根据电接触理论的发展过程,并结合煤矿生产现状对目前国内外电接触可靠性研究中的几个热点问题进行了分析。......